New Type UDS Spin Coater (Resist Stripping/Lift-Off System)
Significant reduction in footprint and purchase costs, increased throughput, and substantial improvement in substrate quality.
■Suitable for various WET processes such as etching, RCA cleaning, and developing ■Ideal for organic stripping/lift-off processes that do not use ultrasound ◎Compatible with high-pressure jet and spray treatments ◎When using ultrasound for effective removal of dry-etch residues and burrs during lift-off, the "Spin Dip Processor" is recommended. ■Full process of chemical solution ⇒ rinse ⇒ drying in a single chamber, supporting Dry-In/Dry-Out ◎Conventional method: 2-chamber configuration (substrate remains in a chemical solution during transfer between chambers) ◎New method: UDS type uses a 1-chamber configuration. ■Basic operation of the substrate ◎ "Upper section... LD of the substrate" ⇒ "Lower section... chemical treatment" ⇒ ⇒ "Middle section... rinse and dry" ⇒ "Upper section... ULD of the substrate" ■The patented isolation plate ensures the concentration of the chemical solution during reuse. ◎Since there is no dilution from rinse water contamination, the chemical solution can be temperature-controlled and reused. *For more details, please refer to the PDF document or feel free to contact us. Wafer, batch-type cleaning equipment, substrate cleaning equipment, spin cleaning equipment, semiconductor manufacturing equipment, resist stripping equipment, resist coating equipment, cleaning equipment, megasonic, photoresist, photolithography process.
- 企業：ソフエンジニアリング
- 価格：Other
